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We provide heat dissipation ceramic solution.

​Please refer to below specifications for your design. We welcome your special requirements. 

We are pleased to provide customized designs for your needs. 

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Ceramic substrate sizes

Size： 1*1 mm ~ 120*120mm

Thickness：0.1~1.0mm

​Shape：square, round and others

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Ceramic metallization

  • methods of metallization：

    • Thick film print ：silver, copper

    • DPC thin film：copper thickness 5um~600um

  • ​surace treatment：

    • standard：e-less Au, e-less silver, e-less Ni/Pd/Au, OSP, e-plating Ni/Au, e-plating Ni/Ag,   e-plating Ni/Pd/Au

    • Special Requirement：cu cavity on cu surface,   e-plating Pt, plating Au/Sn, plating In

  • ​Surface lapping, surface polishing

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Material

  • 96% Al2O3​

  • 99.6% Al2O3

  • ​AlN

  • Si3N4

  • ZTA

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